| Project | Routine | Special |
|---|---|---|
| Layer number | Delamination board 1-6L | 1-6Layer |
| Rigid-Flex PCB 2-4L | ||
| Multilayer board 1-6L | ||
| Plate thickness (minimum) | 0.075mm | |
| Mechanical drilling hole diameter (maximum) | ￠6.0mm | |
| Mechanical drilling hole diameter (minimum) | ￠0.1mm | |
| Hole diameter tolerance (electroplated hole) | ±0.05mm | |
| Hole diameter tolerance (non electroplated hole) | ±0.025mm | |
| Aperture tolerance (compared with CAD data) | ±0.05mm | |
| PTH hole wall copper thickness | 6-30um | |
| Dimensional tolerance of finished product | ±0.05mm~±0.1mm | |
| Etching tolerance | ≦0.1mm±0.02mm >0.1mm±0.03mm | |
| Design line width / spacing (minimum) | Single panel 2 / 2mil (0.05mm / 0.05mm) (copper thickness below 1 / 2oz) | |
| Double sided board 2 / 2mil (0.05mm / 0.05mm) (copper thickness is less than 1 / 2oz) | Multilayer board 2.5 / 2.5mil |
| Project | Routine | Special |
|---|---|---|
| Maximum (minimum) finished size | Min:5*5mm | |
| Max:250*430mm | ||
| Minimum cover film window size | ￠0.5mm | |
| 0.5*0.5mm | ||
| Adhesive overflow during lamination of covering film (minimum) | ≤6mil | |
| Copper thickness | 12um,18um,35um,70um | |
| Punching hole diameter of steel mould (minimum) hole diameter tolerance (minimum) | ￠0.5mm/±0.05mm | |
| Alignment tolerance of fixture fitting operation | ±0.15mm | |
| Punching profile tolerance (edge to edge) (precision steel mold) | ±0.070mm | ±0.05mm |
| Punching profile tolerance (hole to edge) (steel mold) | ±0.1mm | |
| Punching profile tolerance (edge to edge) (cutter die) | ±0.20mm | |
| Punching profile tolerance (edge to edge) (simple steel mold) | ±0.15mm | |
| Dimension tolerance from finger center to plate edge | ±0.10mm | ±0.05mm |
| Tolerance of center distance between adjacent fingers | ±0.03mm |
| Project | Routine | Special |
|---|---|---|
| Surface treatment | Nickel gold plating Ni:2-9um Au:0.01-0.5um | |
| Chemical precipitation of nickel and gold Ni:1.5-3um Au:0.01-0.05um | ||
| Lead free chemical tin deposition Sn:1um Following | ||
| Lead free tin plating Sn:2-6um | ||
| Oxidation protection (OSP) | ||
| Minimum space between character and pad | 0.2mm | |
| Alignment accuracy tolerance of anti welding ink printing | Photosensitive type:±3mil(±0.075mm) | |
| Printing baking type:±8mil(±0. 20mm) | ||
| Thickness of anti welding | Photosensitive type:0.4-1mil(0.010- 0.025mm) | |
| ±0.05mm Adhesive base material（PITCH<55MM) | ||
| Gold finger pitch tolerance | ±0.03mm Adhesiveless FCCL（PITCH<55MM) | |
| Characteristic (single end) impedance tolerance | ±10% | |
| Differential impedance tolerance | ±10% | |
| Base material type | PI |
关闭返回