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Project Routine Special
Layer number Delamination board 1-6L 1-6Layer
Rigid-Flex PCB 2-4L  
Multilayer board 1-6L  
Plate thickness (minimum) 0.075mm  
Mechanical drilling hole diameter (maximum) ¢6.0mm  
Mechanical drilling hole diameter (minimum) ¢0.1mm  
Hole diameter tolerance (electroplated hole) ±0.05mm  
Hole diameter tolerance (non electroplated hole) ±0.025mm  
Aperture tolerance (compared with CAD data) ±0.05mm  
PTH hole wall copper thickness 6-30um  
Dimensional tolerance of finished product ±0.05mm~±0.1mm  
Etching tolerance ≦0.1mm±0.02mm  >0.1mm±0.03mm  
Design line width / spacing (minimum) Single panel 2 / 2mil (0.05mm / 0.05mm) (copper thickness below 1 / 2oz)  
Double sided board 2 / 2mil (0.05mm / 0.05mm) (copper thickness is less than 1 / 2oz) Multilayer board 2.5 / 2.5mil

Project Routine Special
Maximum (minimum) finished size Min:5*5mm  
Max:250*430mm  
Minimum cover film window size ¢0.5mm  
0.5*0.5mm  
Adhesive overflow during lamination of covering film (minimum) ≤6mil  
Copper thickness 12um,18um,35um,70um  
Punching hole diameter of steel mould (minimum) hole diameter tolerance (minimum) ¢0.5mm/±0.05mm  
Alignment tolerance of fixture fitting operation ±0.15mm  
Punching profile tolerance (edge to edge) (precision steel mold) ±0.070mm ±0.05mm
Punching profile tolerance (hole to edge) (steel mold) ±0.1mm  
Punching profile tolerance (edge to edge) (cutter die) ±0.20mm  
Punching profile tolerance (edge to edge) (simple steel mold) ±0.15mm  
Dimension tolerance from finger center to plate edge ±0.10mm ±0.05mm
Tolerance of center distance between adjacent fingers ±0.03mm  

Project Routine Special
Surface treatment Nickel gold plating Ni:2-9um Au:0.01-0.5um  
Chemical precipitation of nickel and gold Ni:1.5-3um Au:0.01-0.05um  
Lead free chemical tin deposition Sn:1um Following  
Lead free tin plating Sn:2-6um  
Oxidation protection (OSP)  
Minimum space between character and pad 0.2mm  
Alignment accuracy tolerance of anti welding ink printing Photosensitive type:±3mil(±0.075mm)  
Printing baking type:±8mil(±0. 20mm)  
Thickness of anti welding Photosensitive type:0.4-1mil(0.010- 0.025mm)  
±0.05mm Adhesive base material(PITCH<55MM)  
Gold finger pitch tolerance ±0.03mm Adhesiveless FCCL(PITCH<55MM)  
Characteristic (single end) impedance tolerance ±10%  
Differential impedance tolerance ±10%  
Base material type PI  
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